Industry Solutions
Real-world case studies demonstrating our engineering expertise across critical industries.
Automotive ECU Selective Soldering Line
!The Challenge
Automotive Tier-1 supplier needed to solder 200+ through-hole points on complex multi-layer ECUs with zero-defect requirements for ISO 26262 compliance. Manual soldering was inconsistent and throughput was too low at 12 units/hour.
→Our Solution
Deployed two SW-5000 Pro dual-pot cells with EMP-800W pumps and NZ-8S nozzles in a fully automated line. Implemented 3D CAD-import programming with closed-loop nitrogen inerting and real-time solder joint inspection.
✓Results
Achieved 45 units/hour throughput with <10 dppm defect rate. ROI within 8 months. Passed all ISO 26262 and IATF 16949 process audits on first attempt.
MIL-SPEC Compliant Soldering for Avionics
!The Challenge
Defense contractor required Class 3 (IPC J-STD-001) soldering for flight-critical avionics modules with 450+ THT joints per board. Existing wave soldering caused thermal damage to adjacent SMD components and failed MIL-STD-202 thermal shock tests.
→Our Solution
Configured SW-3000 with EMP-500W pump and NZ-3M micro-bore nozzles for localized heat application. Added programmable preheat zones and post-solder thermal profiling to meet MIL-STD-202 requirements.
✓Results
100% first-pass yield on qualification batch. Full MIL-STD-202 compliance achieved. Contract value increased 3x due to demonstrated process capability.
EV Inverter High-Current Connector Soldering
!The Challenge
EV power electronics manufacturer struggled with soldering large high-current busbar connectors (12mm copper pins) to PCB. High thermal mass required excessive dwell time that delaminated adjacent substrate layers.
→Our Solution
Implemented SW-5000 Pro with EMP-800W high-power pump, SP-50L solder pot, and NZ-12W wide-angle nozzles. Optimized dwell time profile with pulsed nitrogen-assisted heating to manage thermal transfer without substrate damage.
✓Results
Cycle time reduced from 18s to 5.5s per connector. Zero delamination in 10,000-unit production run. Customer extended deployment to 3 additional manufacturing lines.
Medical Device Micro-Soldering Solution
!The Challenge
Class III medical implant manufacturer needed to solder 0.3mm pitch flex circuits to rigid PCBs with zero ionic contamination per ISO 13485. Existing iron-based process was labor-intensive with 30% rework rate.
→Our Solution
Deployed SW-1000 Desktop with EMP-200W compact pump and NZ-3M micro-bore nozzle. Integrated ultra-pure nitrogen system (99.9999%) with post-solder ultrasonic cleaning and ionic contamination testing station.
✓Results
Rework rate dropped to <1%. Passed ISO 13485 cleanroom validation on first attempt. Manual labor reduced from 3 operators to 1 operator supervising 2 cells. Full FDA 510(k) clearance obtained.